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tccbuilder  (COMSOL Inc)

 
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    Structured Review

    COMSOL Inc tccbuilder
    Comparison of heat-transfer modeling tools
    Tccbuilder, supplied by COMSOL Inc, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
    https://www.bioz.com/product/computer-aided+simulation+program+comsol+multiphysics/pmc11700648-101-18-11?v=COMSOL+Inc
    Average 90 stars, based on 1 article reviews
    tccbuilder - by Bioz Stars, 2026-07
    90/100 stars

    Images

    1) Product Images from "TCCbuilder: An open-source tool for the analysis of thermal switches, thermal diodes, thermal regulators, and thermal control circuits"

    Article Title: TCCbuilder: An open-source tool for the analysis of thermal switches, thermal diodes, thermal regulators, and thermal control circuits

    Journal: iScience

    doi: 10.1016/j.isci.2024.111263

    Comparison of heat-transfer modeling tools
    Figure Legend Snippet: Comparison of heat-transfer modeling tools

    Techniques Used: Comparison

    GUI of TCCbuilder (A) The menu, controls, and the canvas of the GUI, with a user-drawn solid-state thermal diode. (B) The basic component, the six main TCEs, and a heat source/sink, as represented in the GUI. (C) Flowchart of the modeling of TCCs in TCCbuilder. First, the user draws a TCC on the canvas, specifies the materials and properties for the components or TCEs, sets the simulation parameters, and starts the simulation. The simulation runs until the user stops it.
    Figure Legend Snippet: GUI of TCCbuilder (A) The menu, controls, and the canvas of the GUI, with a user-drawn solid-state thermal diode. (B) The basic component, the six main TCEs, and a heat source/sink, as represented in the GUI. (C) Flowchart of the modeling of TCCs in TCCbuilder. First, the user draws a TCC on the canvas, specifies the materials and properties for the components or TCEs, sets the simulation parameters, and starts the simulation. The simulation runs until the user stops it.

    Techniques Used:

    System for cooling a GaN device placed on a printed-circuit board and the temporal development of the GaN temperature and the heat fluxes inside the TCC (A) A 2D representation. Adapted with permission from. (B) An equivalent 1D TCC as used in TCCbuilder. (C) The TCC as represented in TCCbuilder, from left to right: PCB as a thermal resistor, GaN device as a thermal capacitor, bottom thermal spreader as a thermal conduit, thermal buffer with PCM as a thermal capacitor, and top thermal spreader as a thermal conduit. The TCC is rotated by 90° with respect to (B) so that the direction of the heat flux is horizontal. (D) Temperature as measured and simulated in (blue line) and calculated with TCCbuilder (dark-pink line). The light-pink line represents the values calculated with TCCbuilder when the thermal contact resistance between the GaN and the bottom spreader is twice as high as in the experiment. (E) Comparison of the temporal development of the heat fluxes from the GaN device to the bottom and to the top of the TCC, as measured and simulated in (red and dark-blue line) and calculated with TCCbuilder (dark-pink and blue line). The light-pink and cyan lines represent the values calculated with TCCbuilder when the thermal contact resistance between the GaN and the bottom spreader is twice as high as reported in the experiment.
    Figure Legend Snippet: System for cooling a GaN device placed on a printed-circuit board and the temporal development of the GaN temperature and the heat fluxes inside the TCC (A) A 2D representation. Adapted with permission from. (B) An equivalent 1D TCC as used in TCCbuilder. (C) The TCC as represented in TCCbuilder, from left to right: PCB as a thermal resistor, GaN device as a thermal capacitor, bottom thermal spreader as a thermal conduit, thermal buffer with PCM as a thermal capacitor, and top thermal spreader as a thermal conduit. The TCC is rotated by 90° with respect to (B) so that the direction of the heat flux is horizontal. (D) Temperature as measured and simulated in (blue line) and calculated with TCCbuilder (dark-pink line). The light-pink line represents the values calculated with TCCbuilder when the thermal contact resistance between the GaN and the bottom spreader is twice as high as in the experiment. (E) Comparison of the temporal development of the heat fluxes from the GaN device to the bottom and to the top of the TCC, as measured and simulated in (red and dark-blue line) and calculated with TCCbuilder (dark-pink and blue line). The light-pink and cyan lines represent the values calculated with TCCbuilder when the thermal contact resistance between the GaN and the bottom spreader is twice as high as reported in the experiment.

    Techniques Used: Comparison

    Comparison of the temporal development of a temperature span of the double-unit electrocaloric (EC) polymer-based cooling device operating with an electric field of 60.6 MVm –1 and a frequency of 1 Hz, as obtained from the experiment and calculated with TCCbuilder (A) Idealized case with h = 0 Wm –2 K −1 and R = 0 m 2 kW −1 . (B) With the convection coefficient set to h = 5 Wm –2 K −1 and different values of R . (C) With the convection coefficient set to h = 10 Wm –2 K −1 and different values of R . (D) With the convection coefficient set to h = 25 Wm –2 K −1 and different values of R . The legend in (B) also applies for (C) and (D).
    Figure Legend Snippet: Comparison of the temporal development of a temperature span of the double-unit electrocaloric (EC) polymer-based cooling device operating with an electric field of 60.6 MVm –1 and a frequency of 1 Hz, as obtained from the experiment and calculated with TCCbuilder (A) Idealized case with h = 0 Wm –2 K −1 and R = 0 m 2 kW −1 . (B) With the convection coefficient set to h = 5 Wm –2 K −1 and different values of R . (C) With the convection coefficient set to h = 10 Wm –2 K −1 and different values of R . (D) With the convection coefficient set to h = 25 Wm –2 K −1 and different values of R . The legend in (B) also applies for (C) and (D).

    Techniques Used: Comparison, Polymer, Convection

    TCC for energy harvesting from ambient thermal fluctuations (A) Top: TCC for energy harvesting from ambient-temperature fluctuations, adapted with permission from. Bottom: TCC representation in TCCbuilder. (B) Comparison of temporal development of dimensionless temperature difference across the heat engine as obtained in and calculated with TCCbuilder, for different β parameters of the thermal diodes. (C) Comparison of dimensionless power of the heat engine as given in and calculated with TCCbuilder, with respect to the dimensionless frequency ν of the ambient-temperature fluctuation.
    Figure Legend Snippet: TCC for energy harvesting from ambient thermal fluctuations (A) Top: TCC for energy harvesting from ambient-temperature fluctuations, adapted with permission from. Bottom: TCC representation in TCCbuilder. (B) Comparison of temporal development of dimensionless temperature difference across the heat engine as obtained in and calculated with TCCbuilder, for different β parameters of the thermal diodes. (C) Comparison of dimensionless power of the heat engine as given in and calculated with TCCbuilder, with respect to the dimensionless frequency ν of the ambient-temperature fluctuation.

    Techniques Used: Comparison

    Validation of TCCbuilder with a magnetocaloric cooling device (A) A magnetocaloric cooling device, as represented in the TCCbuilder GUI, from left to right: heat source, thermal switch 1, magnetocaloric material, thermal switch 2, and heat sink. (B) Comparison of the temporal development of the heat-source temperature of a magnetocaloric cooling device operating with a magnetic field of 1 T and a frequency of 0.001 Hz, calculated with Heatrapy (blue line) and with TCCbuilder (red line).
    Figure Legend Snippet: Validation of TCCbuilder with a magnetocaloric cooling device (A) A magnetocaloric cooling device, as represented in the TCCbuilder GUI, from left to right: heat source, thermal switch 1, magnetocaloric material, thermal switch 2, and heat sink. (B) Comparison of the temporal development of the heat-source temperature of a magnetocaloric cooling device operating with a magnetic field of 1 T and a frequency of 0.001 Hz, calculated with Heatrapy (blue line) and with TCCbuilder (red line).

    Techniques Used: Biomarker Discovery, Comparison


    Figure Legend Snippet:

    Techniques Used: Software



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