Journal: Micromachines

Article Title: Disposable DNA Amplification Chips with Integrated Low-Cost Heaters †

doi: 10.3390/mi11030238

Figure Lengend Snippet: COMSOL Multiphysics 5.3a finite element method heat transfer simulations of a 0.75 mm deep chamber with different heater widths and heater spacings. Panel ( a ) shows the schematics with the materials indicated in the figure and the heaters exaggerated in red (they are 1 dimensional lines in the simulation model). Panel ( b ) shows the case for 0.3 mm heater width and 0.3 mm heater spacing. Panel ( c ) shows the case for 0.3 mm heater width and 2.0 mm heater spacing. The scale bar in panel ( d ) is in °C and applies to both panels ( b ) and ( c ).

Article Snippet: Based on the analysis of the milling process, metal adhesion studies, and COMSOL MultiPhysics heat transfer simulations, the first batch of chips has been fabricated and successful multiple displacement amplification reactions are performed inside these chips.

Techniques:

Journal: Micromachines

Article Title: Disposable DNA Amplification Chips with Integrated Low-Cost Heaters †

doi: 10.3390/mi11030238

Figure Lengend Snippet: Three temperature differences within the system. In panel ( a ) the Δ T top of chamber , in panel ( b ) the Δ T across chamber , in panel ( c ) the Δ T bottom of chamber , and in panel ( d ) the Δ T deviation from set T are shown for different heater widths (0.3 mm to 2.0 mm, in the columns) and heater spacings (0.3 mm to 2.0 mm, in the rows). The differences are obtained using a parametric sweeps for both the heater width and heater spacing in the COMSOL Multiphysics 5.3a finite element method heat transfer simulations. The cells in dark indicate the smallest Δ T and the cells in white the largest Δ T .

Article Snippet: Based on the analysis of the milling process, metal adhesion studies, and COMSOL MultiPhysics heat transfer simulations, the first batch of chips has been fabricated and successful multiple displacement amplification reactions are performed inside these chips.

Techniques: